上市公司資料
 
合肥晶合集成電路股份有限公司 股票代號:  02249
NEXCHIP SEMICONDUCTOR CORPORATION 集團網址: http://www.nexchip.com.cn
資產
  2025/12
RMB(K$)
變動 2024/12
RMB(K$)
2023/12
RMB(K$)
固定資產42,474,08411.518%38,087,35133,910,224
攤佔聯營公司及共同控制公司權益549,728210.386%177,111100,000
其他資產2,729,43214.190%2,390,2522,200,730
流動資產7,544,725-22.570%9,743,86811,945,324
    庫存現金及銀行結存2,276,620-60.929%5,826,8956,506,676
    存貨1,714,85714.071%1,503,3211,492,685
    其他流動資產3,553,24847.215%2,413,6523,945,963
總資產53,297,9695.753%50,398,58248,156,278
負債
  2025/12
RMB(K$)
變動 2024/12
RMB(K$)
2023/12
RMB(K$)
流動負債5,261,431-29.146%7,425,76714,016,600
長期負債19,948,84918.153%16,883,84712,001,514
總負債25,210,2803.705%24,309,61426,018,114
主要財務比率
  2025/12
RMB(K$)
變動 2024/12
RMB(K$)
2023/12
RMB(K$)
流動比率(x)1.434--1.3120.852
長期負債/股東資金比率(%)91.641%--80.899%56.056%
總負債/股東資金比率(%)115.811%--116.479%121.524%

 

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