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業務類別
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Semiconductor Equipment & Materials |
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業務概覽
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Amtech Systems Inc provides equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication. Its products are used to fabricate and package GPUs for AI applications, SiC and Si power devices,and other optical, analog and digital devices, and are sold to semiconductor packaging, electronic assembly and device fabrication companies. It operates through two segments: Thermal Processing Solutions, which includes conveyorized reflow equipment, high-temperature conveyorized furnaces and diffusion furnaces with maximum revenue; and Semiconductor Fabrication Solutions, which includes consumables, equipment and services for wafer polishing, dicing and cleaning. The majority of revenue is derived from the United States. |
| 公司地址
| 58 South River Drive, Suite 370, Tempe, AZ, USA, 85288 |
| 電話號碼
| +1 480 967-5146 |
| 傳真號碼
| +1 480 968-3763 |
| 公司網頁
| https://www.amtechsystems.com |
| 員工數量
| 264 |
| Mr. Robert C. Daigle |
Chairman of the Board, President and Chief Executive Officer |
美元 450.00K |
23/01/2026 |
| Mr. Mark D. Weaver |
Interim Chief Financial Officer and Principal Accounting Officer |
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15/12/2025 |
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| Mr. Michael Garnreiter |
Independent Director |
23/01/2026 |
| Mr. Robert C. Daigle |
Chairman of the Board, President and Chief Executive Officer |
23/01/2026 |
| Mr. Robert M. Averick |
Lead Independent Director |
23/01/2026 |
| Mr. Michael M. Ludwig |
Independent Director |
23/01/2026 |
| Mr. Asif Y. Jakwani |
Independent Director |
23/01/2026 |
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